Technical Support

Technical Support (3)

IFAE's technology offering and opportunities for collaboration

Find below IFAE's technology offering and opportunities for collaborations in the following sectors:

  • Medical Imaging
  • Quality control & Inspection camera ASICs / FPGAs
  • Environmental detectors
  • IoT & BIG DATA hardware / software
  • Computing
  • Aerospace dosimetry
  • Automotive self-diagnostics & monitoring
  • Ultra-high resolution electron microscopy radiation detectors

 

 

1. VIP (Voxel Imaging PET) - A High Spatial and Energy Resolution (FWHM 1-2%) for Nuclear Imaging Diagnostics

A novel detector module (patent granted: United States, Japan, China; patent application: Europe) for Nuclear Medicine Imaging devices, such as Positron Emission Tomography (PET) detector which provides excellent energy and spatial resolution when compared to the current state-of-the-art PET detectors.

TYPE OF PARTNER SOUGHT

• Greatly improve the spatial resolution thanks to an extremely minimized voxel module size of 1mm x1mmx2mm.
• Excellent energy resolution of 1-2% at an energy of 511 keV., thus reducing the scatter fraction from 40% to 4% and hence the noise of the reconstructed PET image get reduce.
• Small Parallax and small scattered fraction implies the detection of cancerous lesion as small as 2mm.
• Available to demonstrate as prototype

SECTORS

Medical Imaging

MORE INFORMATION

2. LINDA (LINe Detector with Novel Photon Counting)

X‐ray inspection tool used as quality control in the food industry to detect contaminants in food products.

INNOVATIVE ASPECTS AND MAIN ADVANTAGES/BENEFITS

• The energy resolution of the X-ray photons. The camera chip can differentiate 6 levels of energy.
• Photon counting
• High spatial resolution with a pixel size of 330 µm.
• Use of the technology Time Delay Integration.

CURRENT STAGE OF DEVELOPMENT

TRL 4/5 . Patent application: Photon Counting

TYPE OF PARTNER SOUGHT

Collaborative research with academia and/or industry in the framework of national and international calls for innovation projects (Eureka, H2020, Nuclis,..) or patent/know-how licensing offer. 

SECTORS

Medical Imaging, Quality control & Inspection camera ASICs / FPGAs, Aerospace dosimetry

MORE INFORMATION

3. Novel PSK modulation method and demodulator that doubles transfer data rates

IFAE has developed and started international patent protection for a new method of modulation and demodulation of Binary PSK and Quadrature PSK signals that doubles the data rate of current communication systems based on BPSK or QPSK modulations.

INNOVATIVE ASPECTS AND MAIN ADVANTAGES/BENEFITS

• Encoding 2 bits of information per symbol for BPSK modulation and 4 bits of information per symbol for QPSK modulation maintaining signal to noise ratio.
• Double the number of channels keeping data rate, or double the data rate keeping the channel bandwidth what reduces the duty cycle and the power consumption of the devices.
• Compatibility with current BPSK and QPSK communication standards.

CURRENT STAGE OF DEVELOPMENT

TRL 3. PCT application "Method for modulating and demodulating PSK signals and demodulator thereof"

TYPE OF PARTNER SOUGHT

Companies dedicated to the development of high performance ICT devices based on BPSK/QPSK modulation willing to acquire this IFAE technology through a co-development and/or license agreement.

SECTORS

IoT & BIG DATA hardware / software

MORE INFORMATION

 

4. DIGITAL STEREOTAXIC BIOPSY SYSTEM

The invention relates to a digital system for performing stereotaxic biopsies with a biopsy needle. The inventive system comprises a series of devices which are used to position a tissue sample between the X-ray source and the detector, process the electric signals, and generate 3D images. This technology allows for new developments in 3D biopsy on Tomosynthesis

Patent Granted

 

5. Low cost HVCMOS pixel detector

Development of radiation detectors based on the HV/HR-CMOS technology

TYPE OF PARTNER SOUGHT

• The main advantage of this technology is cost reduction, since it does not require bump-bonding.
• Photon counting device with very small pixels are possible.
• Fast readout time compared to CCDs.
• Medical Imaging and synchrotron applications.

SECTORS

Medical Imaging, Quality control & Inspection camera ASICs / FPGAs, Aerospace dosimetry, Environmental detectors, Aerospace dosimetry, Automotive self-diagnostics & monitoring, Ultra-high resolution electron microscopy radiation detectors

MORE INFORMATION

 

6. POLLUTANT HUNTER LIDAR

The PH Lidar is an improvement of the current aerosol ground based LIDAR technologies, to be able to make a more precise determination of these particles with reduced cost.

INNOVATIVE ASPECTS AND MAIN ADVANTAGES/BENEFITS

• High particle resolution range offering a reduced size.
• Improved data processing speed by a factor 2.
• Lower energy consumption which implies lower cost, with improved electronic performance compared with the state-of-the-art. .

CURRENT STAGE OF DEVELOPMENT

TRL 3.

TYPE OF PARTNER SOUGHT

Collaborative research with academia and/or industry in the framework of national and international calls for innovation projects (Eureka, H2020, Nuclis,..).

SECTORS

Environmental detectors

MORE INFORMATION

 

7. ULTRA DENSE INMERSED SERVERS

The project consist of designing a computer compatible with the immersion cooling infrastructure that allows to maximize the efficiency of data centers.

TYPE OF PARTNER SOUGHT

• Ultra-dense server
• Miniaturization of components
• Selection of the most suitable materials to exploit their efficiency.

SECTORS

Computing, IoT & BIG DATA hardware / software

MORE INFORMATION

 

8. DATA LOGGER CONTROL SOFTWARE

Software to monitor and control systems based on the event subscription methodology. A series of modules can be pluged on a central service in order to control any device that can be accessed using python on the host platform. In parallel we have developed a daughter board for raspberry pi systems to be able to read a big range of sensors. The transmission of data is via wifi. It will be the next generation of IoT controlled systems.

INNOVATIVE ASPECTS AND MAIN ADVANTAGES/BENEFITS

• Cost savings
• Improved asset utilization
• More efficient processes
• Improved productivity

CURRENT STAGE OF DEVELOPMENT

TRL 4

TYPE OF PARTNER SOUGHT

Collaborative research with academia and/or industry in the framework of national and international calls for innovation projects (Eureka, H2020, Nuclis,..) or know-how licensing offer.

SECTORS

IoT & BIG DATA hardware / software, Automotive self-diagnostics & monitoring

Miércoles, 02 Diciembre 2015 15:23

IFAE Microelectronic Services

Written by

IFAE Microelectronic Services for Industry

  

The IFAE Microelectronics laboratory is equipped with the ultimate packaging and assembly technologies, including automated wire-bonding, flip-chip and device inspection facilities hosted in a clean room infrastructure class 100.000/10.000/1.000.

IFAE covers the whole microelectronics assembly process, offering wide experience, know-how and singular infrastructure for design, pre-production and quality assurance, including:

  • Digital, analog and mixed-signal ASIC design
  • FPGA and microcontroller programming
  • ASIC, FPGA and microcontroller assembly

IFAE, is an R&D CERCA center, member of the Barcelona Institute of Science and Technology (BIST), having the Severo Ochoa'12 Award for its international prestige in basic and applied physics.


IFAE expertise in microelectronics is focused in the development of solid-state radiation pixel detectors for different applications, including high energy physics experiments and medical radiology.

 

Contact us at: Esta dirección de correo electrónico está protegida contra spambots. Usted necesita tener Javascript activado para poder verla.

Download our Microelectronics Services & Tecnology Offering brochures:

 

  Our Customers 

  Our Projects  

   Our Systems  

  Services  

 

Our Customers


 

 

Our Projects

  Voxel Imaging Positron Emision Tomography Pathfinder (VIP) at IFAE      
  Large Hadron Collider (LHC) at CERN (Geneve, Switzerland)
  Cerenkov Telescope Array (CTA) at ORM (La Palma, Spain)

 

 

Our Systems

1. Microelectronics assembly line:

  

Solder bump deposition

A SB2-SM machine provides bumps with different alloys such as Sn Ag in a range from 40 to 760 microns.

                                                                                                                                   
 

Bump bonding

A Suss FC-150 machine is used for the complex process of flip-chipping. High-density interconnections of solder bumps of typical 25 micron diameter can be achieved with this technique.
 

Reflow Oven

An AVT oven is used for reflow soldering of surface mount electronic components to printed circuit boards (PCB) or other substrates.

Device assembly

The Finetech pick and place machine provides 5 micron positioning precision.

Wire-bonding

An automatic Delvotec G5 bonder offers solutions for the most demanding integration needs.

2. Asembly quality control and characterization

 

 

X-Ray inspection machine

Inspection of assemblies using an x-ray system of sub-micron resolution. 
                            
 

Probe station

Electrical characterization of microelectronic devices.
 
 

 Pull and shear bond tester

The DAGE 4000 Plus system is a multipurpose bond-tester used to ensure the qualityof the critical interconnections.

 

 

IFAE Microelectronics Services 

 

We offer solutions in the field of radiation & particle detectors based on tailored electronics & microelectronics technology

We also offer collaborative research with industry in the framework of public funding at national and international level.

  • Pixel detector development, including readout and front-end electronics
  • X-Ray, Nuclear Medicine and IR-Vis Camera design and construction
  • High performance R+D including: high vacuum and cryogenics
  • High precision mechanics, electronics, optics & control software 

 

Miércoles, 18 Julio 2012 06:49

Technical Support Home

Written by

SERVEIS D'ENGINYERIA

1) Sala blanca: consta de tres sales, dues d'aproximadament 12 metres quadrats de classes B i C i una d'uns 20 metres quadrats de tipus A. La sala blanca està equipada amb una màquina de "wire-bonding" model Delvotec Model 64000G5 i una màquina de "solder-ball" Bumper SB-M (Test de sensors).

2) Sala fosca per a treball amb sistemes òptics i test de sensors CCDs i dispositius sensibles a la llum.

3) Disseny electrònic: Llarga experiència en sistemes de Front-End, lectura de sensors i condicionament del senyal. També en sistemes de test i control.

4) Taller electrònic per a desenvolupament de prototips i soldatge de components electrònics.

5) Disseny mecànic: Especialitat en peces de precisió, sistemes de buit, criogènia i moviments precisos. Igualment dissenys de sistemes de gran tonatge.

6) Maquinària treball mecànic de precisió: Capacitat de fer peces tant petites com de gran volum.  (imatge1, imatge2, imatge3, peces de precisió, peces grans de precisió, sistema mecànic per tests).

7) Taula metrologia per escanejat de superfícies amb una precissió en x-y millor de 5mm i una precisió en z d'una micra.

8) Disseny de sistemes de software de control per a instrumentació científica.

 

Per a més informació, la persona de contacte és

Laia Cardiel Sas ( Esta dirección de correo electrónico está protegida contra spambots. Usted necesita tener Javascript activado para poder verla. )

Tel: 93 586 8226

Utilizamos cookies propias y de terceros para mejorar nuestros servicios mediante el análisis de sus hábitos de navegación. Si continua navegando, consideramos que acepta su uso. Puede cambiar la configuración u obtener más información en nuestra "política de Cookies".

Acepto las cookies de este sitio.