IFAE Microelectronic Services for Industry

  

The IFAE Microelectronics laboratory is equipped with the ultimate packaging and assembly technologies, including automated wire-bonding, flip-chip and device inspection facilities hosted in a clean room infrastructure class 100.000/10.000/1.000.

IFAE covers the whole microelectronics assembly process, offering wide experience, know-how and singular infrastructure for design, pre-production and quality assurance, including:

  • Digital, analog and mixed-signal ASIC design
  • FPGA and microcontroller programming
  • ASIC, FPGA and microcontroller assembly

IFAE, is an R&D CERCA center, member of the Barcelona Institute of Science and Technology (BIST), having the Severo Ochoa'12 Award for its international prestige in basic and applied physics.


IFAE expertise in microelectronics is focused in the development of solid-state radiation pixel detectors for different applications, including high energy physics experiments and medical radiology.

 

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Download our Microelectronics Services & Tecnology Offering brochures:

 

  Our Customers 

  Our Projects  

   Our Systems  

  Services  

 

Our Customers


 

 

Our Projects

  Voxel Imaging Positron Emision Tomography Pathfinder (VIP) at IFAE      
  Large Hadron Collider (LHC) at CERN (Geneve, Switzerland)
  Cerenkov Telescope Array (CTA) at ORM (La Palma, Spain)

 

 

Our Systems

1. Microelectronics assembly line:

  

Solder bump deposition

A SB2-SM machine provides bumps with different alloys such as Sn Ag in a range from 40 to 760 microns.

                                                                                                                                   
 

Bump bonding

A Suss FC-150 machine is used for the complex process of flip-chipping. High-density interconnections of solder bumps of typical 25 micron diameter can be achieved with this technique.
 

Reflow Oven

An AVT oven is used for reflow soldering of surface mount electronic components to printed circuit boards (PCB) or other substrates.

Device assembly

The Finetech pick and place machine provides 5 micron positioning precision.

Wire-bonding

An automatic Delvotec G5 bonder offers solutions for the most demanding integration needs.

2. Asembly quality control and characterization

 

 

X-Ray inspection machine

Inspection of assemblies using an x-ray system of sub-micron resolution. 
                            
 

Probe station

Electrical characterization of microelectronic devices.
 
 

 Pull and shear bond tester

The DAGE 4000 Plus system is a multipurpose bond-tester used to ensure the qualityof the critical interconnections.

 

 

IFAE Microelectronics Services 

 

We offer solutions in the field of radiation & particle detectors based on tailored electronics & microelectronics technology

We also offer collaborative research with industry in the framework of public funding at national and international level.

  • Pixel detector development, including readout and front-end electronics
  • X-Ray, Nuclear Medicine and IR-Vis Camera design and construction
  • High performance R+D including: high vacuum and cryogenics
  • High precision mechanics, electronics, optics & control software 

 

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