IFAE Microelectronic Services for Industry
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The IFAE Microelectronics laboratory is equipped with the ultimate packaging and assembly technologies, including automated wire-bonding, flip-chip and device inspection facilities hosted in a clean room infrastructure class 100.000/10.000/1.000. IFAE covers the whole microelectronics assembly process, offering wide experience, know-how and singular infrastructure for design, pre-production and quality assurance, including:
IFAE, is an R&D CERCA center, member of the Barcelona Institute of Science and Technology (BIST), having the Severo Ochoa'12 Award for its international prestige in basic and applied physics.
Contact us at: This email address is being protected from spambots. You need JavaScript enabled to view it. |
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Download our Microelectronics Services & Tecnology Offering brochures: |
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Our Customers
Our Projects
Our Systems
Services
Our Customers
Our Projects
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Voxel Imaging Positron Emision Tomography Pathfinder (VIP) at IFAE |
| Large Hadron Collider (LHC) at CERN (Geneve, Switzerland) | |
| Cerenkov Telescope Array (CTA) at ORM (La Palma, Spain) |
Our Systems
1. Microelectronics assembly line:
A SB2-SM machine provides bumps with different alloys such as Sn Ag in a range from 40 to 760 microns. An AVT oven is used for reflow soldering of surface mount electronic components to printed circuit boards (PCB) or other substrates.
Solder bump deposition
Bump bonding
A Suss FC-150 machine is used for the complex process of flip-chipping. High-density interconnections of solder bumps of typical 25 micron diameter can be achieved with this technique.
Reflow Oven
Device assembly
The Finetech pick and place machine provides 5 micron positioning precision.
Wire-bonding
An automatic Delvotec G5 bonder offers solutions for the most demanding integration needs.
2. Asembly quality control and characterization
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X-Ray inspection machineInspection of assemblies using an x-ray system of sub-micron resolution. |
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Probe stationElectrical characterization of microelectronic devices. |
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Pull and shear bond testerThe DAGE 4000 Plus system is a multipurpose bond-tester used to ensure the qualityof the critical interconnections. |
IFAE Microelectronics Services
We offer solutions in the field of radiation & particle detectors based on tailored electronics & microelectronics technology
We also offer collaborative research with industry in the framework of public funding at national and international level.
- Pixel detector development, including readout and front-end electronics
- X-Ray, Nuclear Medicine and IR-Vis Camera design and construction
- High performance R+D including: high vacuum and cryogenics
- High precision mechanics, electronics, optics & control software
